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packaging information issi ? rev.d 02/25/03 copyright ? 2003 integrated silicon solution, inc. all rights reserved. issi reserves the right to make changes to this specification and its products at any time without notice. issi assumes no liability arising out of the application or use of any information, products or services described herein. customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. 300-mil plastic soj package code: j notes: 1.controlling dimension: inches, unless otherwise specified. 2.bsc = basic lead spacing between centers. 3.dimensions d and e1 do not include mold flash protrusions and should be measured from the bottom of the package . 4.formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. millimeters inches sym.min.typ.max.min.typ.max. seating plane 1 n e1 d e2 e b e a1 a b c a2
packaging information issi ? 2 rev. d 02/25/03 millimeters inches sym.min.typ.max.min.typ.max. millimeters inches sym.min.typ.max.min.typ.max. 300-mil plastic soj package code: j
issi ? packaging information d seating plane b e c 1 e a1 a s h l n plastic tsop - 28-pins package code: t (type i) plastic tsop (t type i) millimetersinches symbolminmaxminmax ref. std. no. leads 28 a1.001.200.0370.047 a10.050.200.0020.008 b0.160.270.0060.011 c0.100.200.0040.008 d7.908.100.3080.316 e11.7011.900.4560.465 h13.2013.600.5150.531 e0.55 bsc0.022 bsc l0.300.700.0110.027 0 5 0 5 notes: 1.controlling dimension: millimeters, unless otherwise specified. 2.bsc = basic lead spacing between centers. 3.dimensions d and e do not include mold flash protrusions and should be measured from the bottom of the package . 4.formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. pk13197t28 rev. b 01/31/97
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